• DocumentCode
    170168
  • Title

    Analysis of cell-aware test pattern effectiveness — A case study using a 32-bit automotive microcontroller

  • Author

    Prabhu, Akshata ; Vorisek, Vlado ; Lang, Helmut ; Schumann, T.

  • Author_Institution
    Hochschule Darmstadt-Univ. of Appl. Sci., Darmstadt, Germany
  • fYear
    2014
  • fDate
    26-30 May 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    With the semiconductor manufacturing development following the trend into very-deep sub-micron technologies and thus making Moore´s law a reality, the decrease in node size introduces new defect mechanisms in manufacturing. Still, the strict quality requirements especially related to the automotive industry stay the same. Traditional fault models like stuck-at and transition delay models which have been used for the digital logic of System-on-Chip designs may be successful in detecting most of the manufacturing defects, but not all of them. In this paper, the new Cell Aware fault model, which has been introduced by Mentor Graphics®, is being evaluated for usage in the automotive design process of Freescale™. Using a state-of-the-art microcontroller product manufactured in a CMOS 55nm process technology, the fault model is evaluated for test coverage and test cost (pattern count) and compared against the traditional fault models used by Freescale. The analysis is carried out by performing several experiments, especially focusing on reducing the test pattern count overhead.
  • Keywords
    CMOS integrated circuits; automatic test pattern generation; automotive electronics; fault diagnosis; logic testing; microcontrollers; system-on-chip; CMOS process technology; Freescale; Mentor Graphics; Moore law; automotive design process; automotive industry; automotive microcontroller; cell aware fault model; cell-aware test pattern; defect mechanism; digital logic; manufacturing defects; quality requirements; semiconductor manufacturing; size 55 nm; stuck-at model; system-on-chip; transition delay model; very-deep sub-micron technologies; word length 32 bit; Automatic test pattern generation; Automotive engineering; Circuit faults; Delays; Libraries; Manufacturing; Semiconductor device modeling; ATPG; Cell-Aware; DFT; Design; for-Test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ETS), 2014 19th IEEE European
  • Conference_Location
    Paderborn
  • Type

    conf

  • DOI
    10.1109/ETS.2014.6847826
  • Filename
    6847826