Title :
The prospect of 3D-IC
Author :
Wong, S. Simon ; El Gamal, Abbas
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
Abstract :
This paper illustrates the performance advantages of 3D integrated circuits with two specific examples, namely 3D-FPGA and 3D-SRAM. Through strategic modification of the architectures to take advantage of 3D, significant improvement in speed and reduction in power consumption can be achieved.
Keywords :
CMOS memory circuits; SRAM chips; field programmable gate arrays; integrated circuit technology; monolithic integrated circuits; 3D integrated circuits; 3D-FPGA; 3D-IC; 3D-SRAM; CMOS memory circuits; monolithic integrated circuits; power consumption reduction; Energy consumption; Three-dimensional integrated circuits;
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
DOI :
10.1109/CICC.2009.5280818
