Title :
An automated tool deployment for ESD (electrostatic-discharge) correct-by-construction strategy in 90 nm process
Author :
Theng, Chuah Cheow ; Chuan, Yip Boon ; Sidek, Othman
Author_Institution :
Intel Microelectron. (M) Sdn Bhd, Penang, Malaysia
Abstract :
Continuous device scaling adhering to Moore\´s law imposes a greater challenge to the product design envelop. The complexity of ESD protection design can be enormous due to high degree of integration, including high signal count and mix-signal considerations. It is likely to take several design iterations before the specified ESD requirements can be guaranteed (Dabral and Maloney, 1998; Amerasekera and Duvvury, 1995). In view of a shorter design cycle coupled with overwhelming technological challenges in the leading edge 90nm process, an automated tool (RVCAT-ESD) has been deployed for the verification of ESD design rules during the product development stage. The tool can effectively verify both local and global ESD protection rules on the design database. The tool is also capable of providing a panoramic view of the ESD violation nodes in the design layout using the "overlay" feature. This helps to efficiently pin-point ESD design weaknesses in the design layout, such as current congestion, insufficient metal width and etc. This allows ESD design rules compliance in the early design stage, thus enhancing the approach of "correct-by-construction" on ESD design.
Keywords :
CMOS integrated circuits; circuit CAD; electrostatic discharge; integrated circuit design; integrated circuit reliability; product design; 90 nm; ESD design verification; ESD design weakness; ESD protection design; ESD violation nodes; RVCAT-ESD automated tool; electrostatic-discharge; product development stage; Clamps; Diodes; Electrostatic discharge; Microelectronics; Moore´s Law; Product design; Product development; Protection; Signal design; Trade agreements;
Conference_Titel :
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN :
0-7803-8658-2
DOI :
10.1109/SMELEC.2004.1620838