DocumentCode :
1702537
Title :
Pathfinding for 22nm CMOS designs using Predictive Technology Models
Author :
Li, Xia ; Zhao, Wei ; Cao, Yu ; Zhu, Zhi ; Song, Jooyoung ; Bang, David ; Wang, Chi-Chao ; Kang, Seung H. ; Wang, Joseph ; Nowak, Matt ; Yu, Nick
Author_Institution :
QCT Process Technol., Qualcomm Inc., San Diego, CA, USA
fYear :
2009
Firstpage :
227
Lastpage :
230
Abstract :
Traditional IC scaling is becoming increasingly difficult at the 22 nm node and beyond. Dealing with these challenges increase product development cycle time. For continued CMOS scaling, it is essential to start design explorations in new process nodes as early as possible. Such an effort requires having Predictive Technology Models, which bridge technological and design practices, in order to assess the performance impact of future key modules. In this paper we propose a strategy that enables simultaneous investigation of advanced process and design concepts. Based on a customized predictive methodology and silicon data at 90-45 nm nodes, compact transistor and interconnect models are developed for the next generation CMOS technology. We capture the heuristic device behavior during the scaling, which helps us to gain key insights that allow us to make tradeoffs of circuit performance metrics for next technology node.
Keywords :
CMOS integrated circuits; elemental semiconductors; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; silicon; CMOS designs; IC; Si; compact transistor; integrated circuit scaling; interconnect models; pathfinding; predictive technology models; size 22 nm; size 45 nm; size 90 nm; Bridge circuits; CMOS process; CMOS technology; Integrated circuit interconnections; Predictive models; Process design; Product development; Semiconductor device modeling; Silicon; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
Type :
conf
DOI :
10.1109/CICC.2009.5280845
Filename :
5280845
Link To Document :
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