DocumentCode
1702537
Title
Pathfinding for 22nm CMOS designs using Predictive Technology Models
Author
Li, Xia ; Zhao, Wei ; Cao, Yu ; Zhu, Zhi ; Song, Jooyoung ; Bang, David ; Wang, Chi-Chao ; Kang, Seung H. ; Wang, Joseph ; Nowak, Matt ; Yu, Nick
Author_Institution
QCT Process Technol., Qualcomm Inc., San Diego, CA, USA
fYear
2009
Firstpage
227
Lastpage
230
Abstract
Traditional IC scaling is becoming increasingly difficult at the 22 nm node and beyond. Dealing with these challenges increase product development cycle time. For continued CMOS scaling, it is essential to start design explorations in new process nodes as early as possible. Such an effort requires having Predictive Technology Models, which bridge technological and design practices, in order to assess the performance impact of future key modules. In this paper we propose a strategy that enables simultaneous investigation of advanced process and design concepts. Based on a customized predictive methodology and silicon data at 90-45 nm nodes, compact transistor and interconnect models are developed for the next generation CMOS technology. We capture the heuristic device behavior during the scaling, which helps us to gain key insights that allow us to make tradeoffs of circuit performance metrics for next technology node.
Keywords
CMOS integrated circuits; elemental semiconductors; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; silicon; CMOS designs; IC; Si; compact transistor; integrated circuit scaling; interconnect models; pathfinding; predictive technology models; size 22 nm; size 45 nm; size 90 nm; Bridge circuits; CMOS process; CMOS technology; Integrated circuit interconnections; Predictive models; Process design; Product development; Semiconductor device modeling; Silicon; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-4071-9
Electronic_ISBN
978-1-4244-4073-3
Type
conf
DOI
10.1109/CICC.2009.5280845
Filename
5280845
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