DocumentCode :
1702557
Title :
An SRAM reliability test macro for fully-automated statistical measurements of Vmin degradation
Author :
Kim, Tae-Hyoung ; Zhang, Wei ; Kim, Chris H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
fYear :
2009
Firstpage :
231
Lastpage :
234
Abstract :
An SRAM reliability test macro is designed in a 1.2 V, 65 nm CMOS process for statistical measurements of Vmin degradation. An automated test program efficiently collects statistical Vmin data and reduces test time. The proposed test structure enables Vmin degradation measurements for different SRAM failure modes such as the SNM-limited case and the access-time-limited case. The impact of voltage stress on the time to cell data flip was measured.
Keywords :
CMOS memory circuits; SRAM chips; automatic testing; integrated circuit reliability; integrated circuit testing; macros; statistical analysis; voltage measurement; CMOS process; SNM-limited case; SRAM reliability test macro design; access-time-limited case; automated test program; cell data flip; failure modes; fully-automated statistical measurement; minimum operating voltage degradation; size 65 nm; voltage 1.2 V; voltage stress impact; Automatic testing; CMOS process; Degradation; Random access memory; Stress measurement; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
Type :
conf
DOI :
10.1109/CICC.2009.5280846
Filename :
5280846
Link To Document :
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