DocumentCode :
1702744
Title :
Effect of shallow trench isolation induced stress on CMOS transistor mismatch
Author :
Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman
Author_Institution :
Silterra Malaysia Sdn Bhd, Kedah, Malaysia
fYear :
2004
Abstract :
Mechanical compressive stress induced by shallow trench isolation (STI) and transistor mismatch is the two important effects that we should take into account when scaling down CMOS transistors. In this paper, we study the relationship between these two effects. Our finding shows that STI induced stress effect improve NMOS Id matching but degrade PMOS Id matching. These effects become more obvious for small size transistors. The STI stress effect has no significant effect on Vt mismatch.
Keywords :
MOSFET; isolation technology; stress effects; CMOS transistor mismatch; NMOS Id matching; PMOS Id matching; induced stress; mechanical compressive stress; shallow trench isolation; stress effect; CMOS technology; Compressive stress; Degradation; Fingers; MOS devices; Packaging; Shape; Stress measurement; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN :
0-7803-8658-2
Type :
conf
DOI :
10.1109/SMELEC.2004.1620867
Filename :
1620867
Link To Document :
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