Title :
Assembly of high power diode laser emitters
Author :
Kuusiluoma, S. ; Hakamo, M. ; Lassila, E. ; Heino, P. ; Hernberg, R. ; Ristolainen, E.
Author_Institution :
Inst. of Electron., Tampere Univ. of Technol., Finland
Abstract :
Single-emitter high power diode laser chips were mounted on copper heatsinks using gold-tin solder with and without CuW submounts. Theoretical thermal modelling was performed for stacked structures consisting of layers of above mentioned mounted chips.
Keywords :
copper compounds; gold alloys; heat sinks; semiconductor lasers; solders; thermal analysis; tin alloys; Au-Sn; CuW; CuW submounts; copper heatsinks; diode laser chips; gold-tin solder; high power diode laser emitters; high power laser chips; mounted chips; single-emitter laser chips; stacked structures; thermal modelling; Assembly; Bars; Cooling; Copper; Diode lasers; Heat sinks; Laser modes; Laser theory; Thermal stresses; Tin;
Conference_Titel :
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN :
0-7803-8658-2
DOI :
10.1109/SMELEC.2004.1620874
