• DocumentCode
    1703225
  • Title

    Failure analysis on wafer edge issue in 0.13μm technology

  • Author

    Indahwan, Jony ; Song, Z.G. ; Tun, T. ; Oh, C.K. ; Lo, K.F.

  • Author_Institution
    QRA, Chartered Semicond. Manuf. Ltd., Singapore, Singapore
  • fYear
    2004
  • Abstract
    In this paper, two front ends and one back end issues which were found to have cause failure at the edge of wafers on 0.13μm technology would be discussed. They are contact W-extrusion, STI gap-fill issue and Cu puddle due to thin film particle.
  • Keywords
    failure analysis; integrated circuit reliability; integrated circuit testing; 0.13 micron; Cu puddle; STI gap-fill issue; W-extrusion; failure analysis; thin film particle; wafer edge; Failure analysis; Inspection; Lithography; Manufacturing industries; Microelectronics; Pulp manufacturing; Scanning electron microscopy; Semiconductor device manufacture; Semiconductor thin films; Wood industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
  • Print_ISBN
    0-7803-8658-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2004.1620884
  • Filename
    1620884
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1703225