• DocumentCode
    1703290
  • Title

    Foreword: 60 Years of (Em)Powering the Future

  • fYear
    2013
  • Firstpage
    5
  • Lastpage
    5
  • Abstract
    It is my pleasure to welcome you to the 60th International Solid-State Circuits Conference. The Conference continues its outstanding tradition of presenting the most-advanced and innovative work, both from industry and academe, worldwide, in the area of integrated circuits and systems. This year, the geographical distribution of the accepted technical papers, again, illustrates the global character of the Conference: 36% of the accepted papers are from North America, 40% from the Far East, and 24% from Europe. Of all of these, 55% are from academe, 37% are from industry, and 8% from institutions/laboratories.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487606
  • Filename
    6487606