DocumentCode
1703290
Title
Foreword: 60 Years of (Em)Powering the Future
fYear
2013
Firstpage
5
Lastpage
5
Abstract
It is my pleasure to welcome you to the 60th International Solid-State Circuits Conference. The Conference continues its outstanding tradition of presenting the most-advanced and innovative work, both from industry and academe, worldwide, in the area of integrated circuits and systems. This year, the geographical distribution of the accepted technical papers, again, illustrates the global character of the Conference: 36% of the accepted papers are from North America, 40% from the Far East, and 24% from Europe. Of all of these, 55% are from academe, 37% are from industry, and 8% from institutions/laboratories.
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-4515-6
Type
conf
DOI
10.1109/ISSCC.2013.6487606
Filename
6487606
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