Title :
Continuing to shrink: Next-generation lithography - Progress and prospects
Author :
van den Brink, M.
Author_Institution :
ASML, Veldhoven, Netherlands
Abstract :
Chip makers are increasingly concerned about the shrink and cost. This concern drives different lithography solutions for different products. Two major trends can be observed: aggressive adoption of EUV, or aggressive extension of immersion. Further cost reduction could be achieved by introducing 450mm wafers.
Keywords :
immersion lithography; integrated circuit manufacture; ultraviolet lithography; cost reduction; extre ultraviolet lithography; immersion lithography; integrated circuit manufacture; next generation lithography; size 450 mm; Computer architecture; Imaging; Lithography; Metrology; Productivity; Ultraviolet sources;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487620
