DocumentCode :
1703619
Title :
A full chip integrated power and substrate noise analysis framework for mixed-signal SoC design
Author :
Kosaka, Daisuke ; Bando, Yoji ; Yokomizo, Goichi ; Tsuboi, Kunihiko ; Li, Ying Shiun ; Lin, Shen ; Nagata, Makoto
Author_Institution :
Dept. of Comput. Sci. & Syst. Eng., Kobe Univ., Kobe, Japan
fYear :
2009
Firstpage :
219
Lastpage :
222
Abstract :
A fully integrated framework of full-chip power and substrate noise analysis is discussed, featuring description of transistor-level custom circuits as dynamic noise sources, a high capacity solver for chip-level substrate coupling, and noise back annotation flow to transistors of sensitive circuits. Recursive evaluation of power current and operation timing under the presence of dynamic IR drop greatly improves the accuracy of analysis. A 90-nm CMOS chip was examined both by on-chip noise measurements and full-chip noise analysis.
Keywords :
CMOS integrated circuits; integrated circuit design; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; CMOS chip; chip level substrate coupling; dynamic IR drop; full chip integrated power noise analysis; full chip noise analysis; high capacity solver; mixed-signal SoC design; noise back annotation; on chip noise measurements; operation timing; power current; sensitive circuits; size 90 nm; substrate noise analysis; transistor level custom circuit; Circuit noise; Coupling circuits; Noise measurement; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-4071-9
Electronic_ISBN :
978-1-4244-4073-3
Type :
conf
DOI :
10.1109/CICC.2009.5280883
Filename :
5280883
Link To Document :
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