DocumentCode
1703782
Title
A high density board mounted power module for distributed powering architectures
Author
Bowman, Wayne ; Bailey, James ; Boettcher, Charles ; Johnson, Michael ; Magalhaes, Frank ; Nitz, William ; Sarasola, Felipe ; Westerman, George ; Ziesse, Norman
Author_Institution
AT&T Bell Labs., Parsippany, NJ, USA
fYear
1990
Firstpage
43
Lastpage
54
Abstract
A high-density DC/DC converter module developed to be a fundamental building block in a distributed power architecture using a 50 V backplane bus is described. A power density of 55 W/in/sup 3/ has been achieved using a high-frequency fully resonant circuit topology. The converter exhibits an overall efficiency greater than 80% with an 18 MHz nominal switching frequency. Other features of the converter are operation from -55 degrees C to 125 degrees C baseplate temperature and very low input/output ripple and EMI.<>
Keywords
power convertors; -55 to 125 degC; 18 MHz; EMI; distributed power architecture; high-density DC/DC converter module; Backplanes; Circuits; Frequency conversion; Multichip modules; Packaging; Power conditioning; Prototypes; Resonance; Resonant frequency; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1990. APEC '90, Conference Proceedings 1990., Fifth Annual
Conference_Location
Los Angeles, CA, USA
Type
conf
DOI
10.1109/APEC.1990.66396
Filename
66396
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