DocumentCode :
1704572
Title :
Buffer insertion after layer assignment considering process variation based on a systematic ILD model
Author :
Jia, Yanming ; Cai, Yici ; Hong, Xianlong
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume :
2
fYear :
2005
Lastpage :
1219
Abstract :
We present an approach to buffer insertion after layer assignment, considering process variation based on a systematic ILD model. There are three contributions mentioned in the paper: Firstly, a systematic ILD model is introduced to compute the process variation systematically, in order to get accurate timing delay. Secondly, a buffer insertion algorithm considering process variation is presented, which leads to a more accurate results and makes the performance more close to the real manufactured chip, avoiding excessive conservativeness caused by the worst case method. Third, the phase of buffer insertion is executed after layer assignment, so that different electronic parameters and wire density of distinct layers are concerned, and it is better than the traditional solution, which regarded those parameters as constants. Experimental results demonstrate that our approach can decrease the number of buffers about 50% less than the worst case when comparing with the results of L.P.P.P. Van Ginneken (Proc. Int. Symp. on Circuits and Sys., pp. 865-868, Dec. 1990).
Keywords :
buffer circuits; buffer layers; chemical mechanical polishing; delays; dielectric thin films; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; semiconductor process modelling; buffer insertion; buffer insertion algorithm; distinct layers; electronic parameters; layer assignment; manufactured chip; process variation; systematic ILD CMP model; systematic ILD model; timing delay; wire density; worst case method; Capacitance; Circuit optimization; Computer science; Delay effects; Integrated circuit interconnections; Manufacturing processes; Routing; Timing; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, Circuits and Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN :
0-7803-9015-6
Type :
conf
DOI :
10.1109/ICCCAS.2005.1495326
Filename :
1495326
Link To Document :
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