• DocumentCode
    1704572
  • Title

    Buffer insertion after layer assignment considering process variation based on a systematic ILD model

  • Author

    Jia, Yanming ; Cai, Yici ; Hong, Xianlong

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    2005
  • Lastpage
    1219
  • Abstract
    We present an approach to buffer insertion after layer assignment, considering process variation based on a systematic ILD model. There are three contributions mentioned in the paper: Firstly, a systematic ILD model is introduced to compute the process variation systematically, in order to get accurate timing delay. Secondly, a buffer insertion algorithm considering process variation is presented, which leads to a more accurate results and makes the performance more close to the real manufactured chip, avoiding excessive conservativeness caused by the worst case method. Third, the phase of buffer insertion is executed after layer assignment, so that different electronic parameters and wire density of distinct layers are concerned, and it is better than the traditional solution, which regarded those parameters as constants. Experimental results demonstrate that our approach can decrease the number of buffers about 50% less than the worst case when comparing with the results of L.P.P.P. Van Ginneken (Proc. Int. Symp. on Circuits and Sys., pp. 865-868, Dec. 1990).
  • Keywords
    buffer circuits; buffer layers; chemical mechanical polishing; delays; dielectric thin films; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; semiconductor process modelling; buffer insertion; buffer insertion algorithm; distinct layers; electronic parameters; layer assignment; manufactured chip; process variation; systematic ILD CMP model; systematic ILD model; timing delay; wire density; worst case method; Capacitance; Circuit optimization; Computer science; Delay effects; Integrated circuit interconnections; Manufacturing processes; Routing; Timing; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2005. Proceedings. 2005 International Conference on
  • Print_ISBN
    0-7803-9015-6
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2005.1495326
  • Filename
    1495326