DocumentCode :
1705067
Title :
Simulated temperature increase in a head/eye model containing an intraocular retinal prosthesis
Author :
Lazzi, G. ; DeMarco, S.C. ; Wentai Liu ; Humayun, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume :
2
fYear :
2001
Firstpage :
72
Abstract :
We study electromagnetic power deposition and temperature elevation in the human head due to an implantable intraocular retinal prosthesis designed to restore limited vision to individuals suffering blindness from outer retinal degeneration such as Retinitis Pigmentosa and Age-related Macula Degeneration. We have developed a high-resolution 2D human head and eye model at 0.25 mm spatial resolution in order to numerically simulate temperature elevation in the eye and surrounding tissues. A 2D finite difference time domain method (FDTD) with material independent absorbing boundary conditions is used to predict with high detail the specific absorption rate (SAR) induced via inductive powering and telemetry with the implant. A highly detailed heating pattern in the eye tissues due to SAR and power dissipation in the implanted stimulator is computed using a 2D time-domain numerical implementation of the bioheat equation.
Keywords :
dosimetry; electromagnetic wave absorption; eye; finite difference time-domain analysis; heating; prosthetics; 2D FDTD analysis; 2D human head eye model; Age-related Macula Degeneration; Retinitis Pigmentosa; SAR; absorbing boundary conditions; bioheat equation; electromagnetic power deposition; finite difference time domain method; implantable intraocular retinal prosthesis; inductive powering; numerical simulation; outer retinal degeneration; specific absorption rate; telemetry; temperature elevation; Blindness; Finite difference methods; Humans; Numerical simulation; Pigmentation; Prosthetics; Retina; Spatial resolution; Temperature; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2001. IEEE
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7070-8
Type :
conf
DOI :
10.1109/APS.2001.959624
Filename :
959624
Link To Document :
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