Title :
High-temperature Pd Schottky diode gas sensor on p-type GaN
Author :
Hudeish, A.Y. ; Abdul Aziz, A. ; Hassan, Z.
Author_Institution :
Sch. of Phys., Univ. Sains Malaysia, Penang, Malaysia
Abstract :
In this report, Pd Schottky diodes to p-type GaN are described. The response of the diodes to nitrogen and 2 percent hydrogen in nitrogen at temperatures from 50-500 C and the thermal stability of the diodes during long term annealing at 500 C have been investigated by long term annealing at 500 C in Ar. When exposed to changes in ambient, changes in the surface potential will lead to large changes in channel current The results indicate that Pd diodes on p-type GaN appear promising for nitrogen and 2 percent hydrogen in nitrogen detection in this temperature range. The characteristics of Pd Schottky diodes on p-type GaN in nitrogen and 2 percent hydrogen in nitrogen are reported in this report This response has been characterized by current-voltage measurements, revealing that the diodes are able to detect 2 percent hydrogen in nitrogen from 50-500 C and nitrogen from 150-500 C This is roughly double the detection sensitivity of comparable GaN Schottky gas sensors tested under the same conditions, confirming that the Pd/p-type GaN based diode has advantages for applications requiring the ability to detect combustion gases even at room temperature.
Keywords :
III-V semiconductors; Schottky diodes; annealing; argon; gallium compounds; gas sensors; high-temperature techniques; hydrogen; nitrogen; palladium; surface potential; thermal stability; wide band gap semiconductors; 150 to 500 C; 50 to 500 C; GaN; H; N; Pd; Schottky diode; channel current; combustion gases; current-voltage measurement; gas sensor; high-temperature; long term annealing; surface potential; thermal stability; Annealing; Argon; Gallium nitride; Gas detectors; Hydrogen; Nitrogen; Schottky diodes; Temperature distribution; Temperature sensors; Thermal stability;
Conference_Titel :
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN :
0-7803-8658-2
DOI :
10.1109/SMELEC.2004.1620955