• DocumentCode
    1705297
  • Title

    A 0.48V 0.57nJ/pixel video-recording SoC in 65nm CMOS

  • Author

    Tay-Jyi Lin ; Cheng-An Chien ; Pei-Yao Chang ; Ching-Wen Chen ; Po-Hao Wang ; Ting-Yu Shyu ; Chien-Yung Chou ; Shien-Chun Luo ; Jiun-In Guo ; Tien-Fu Chen ; Chuang, G.C.H. ; Yuan-Hua Chu ; Liang-Chia Cheng ; Hong-Men Su ; Chewnpu Jou ; Meikei Leong ; Chen

  • Author_Institution
    Nat. Chung Cheng Univ., Chiayi, Taiwan
  • fYear
    2013
  • Firstpage
    158
  • Lastpage
    159
  • Abstract
    This paper presents a video recording SoC fabricated in 65nm low-power technology, which integrates a complexity and bandwidth-effective H.264 encoder, an ultra-low-power (ULP) MPU, with timing-optimized ROM and 8T SRAM macros for ultra-low-voltage (ULV) operation, a 512Kb ULV and leakage-aware 8T SRAM for the frame buffer (FB), and various on-chip peripherals, such as external memory interfaces (Fig. 9.3.1). Utilizing ULV cell libraries with custom-pulsed D flip-flops (PFF) for wide-range voltage scaling, ROM/SRAM macros optimized simultaneously for timing and leakage, and advanced energy management (AEM), the SoC achieves 32fps HD720 H.264 encoding at 1.0V, down to 0.57nJ/pixel ultra-low energy dissipation at 0.48V (30fps QQVGA H.264 encoding for preview through ANT+).
  • Keywords
    CMOS memory circuits; SRAM chips; buffer storage; data compression; flip-flops; low-power electronics; read-only storage; system-on-chip; video coding; video recording; AEM; HD720 H.264 encoding; PFF; ULP MPU; ULV cell libraries; advanced energy management; bandwidth-effective H.264 encoder; custom-pulsed D flip-flops; external memory interfaces; frame buffer; leakage-aware 8T SRAM; low-power CMOS technology; on-chip peripherals; size 65 nm; storage capacity 512 Kbit; timing-optimized ROM; ultralow-power MPU; ultralow-voltage operation; video-recording SoC; voltage 0.48 V; voltage 1.0 V; wide-range voltage scaling; Algorithm design and analysis; Computer architecture; Delays; Random access memory; Read only memory; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487680
  • Filename
    6487680