Title :
72.5GFLOPS 240Mpixel/s 1080p 60fps multi-format video codec application processor enabled with GPGPU for fused multimedia application
Author :
Yongha Park ; Changhyo Yu ; Kilwhan Lee ; Hyunsuk Kim ; Youngeun Park ; Chunho Kim ; Yunseok Choi ; Jinhong Oh ; Changhoon Oh ; Gurnrack Moon ; Sangduk Kim ; Horang Jang ; Jin-Aeon Lee ; Chinhyun Kim ; Sungho Park
Author_Institution :
Samsung Electron., Yongin, South Korea
Abstract :
72.5GFLOPS GPGPU computing, 240 Mpixel/s sustainable image signal processing and 60fps 1080p multi-format video codec (MFC) capabilities are integrated with an 1.7GHz out-of-order-execution dual-core ARMv7A architecture CPU and 12.8GB/s memory subsystem for a next-generation application processor. The GPU-based general-purpose computing capability can deliver 10× higher energy efficiency in compute-intensive multimedia applications, compared with a CPU solution on the same die. The improved energy efficiency with GPGPU computing enables next-generation fused multimedia applications, with the assistance of dedicated high-performance low-power multimedia accelerators, as well as with low-power design and process technology, as shown in Fig. 9.4.1.
Keywords :
graphics processing units; low-power electronics; microcontrollers; multimedia communication; video codecs; GPGPU computing; GPU-based general-purpose computing capability; MFC; bit rate 12.8 Gbit/s; compute-intensive multimedia applications; dedicated high-performance low-power multimedia accelerators; energy efficiency; frequency 1.7 GHz; low-power design; memory subsystem; multiformat video codec; multiformat video codec application processor; next-generation application processor; next-generation fused multimedia applications; out-of-order-execution dual-core ARMv7A architecture CPU; sustainable image signal processing; Energy efficiency; Graphics processing units; Mobile communication; Multimedia communication; Multimedia computing; Streaming media;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-4515-6
DOI :
10.1109/ISSCC.2013.6487681
