Alternative double pass dicing method for thin wafer laminated with die attach film

This paper introduces an alternative dicing method to reduce lateral crack and chipping problem in dicing 100 μm thickness wafer laminated with die attach film (DAF). Conventional single pass saw process caused lateral crack due to excessive over loading of the epoxy on the blade. To overcome this problem, an alternative method of double pass saw process was proposed to reduce the blade loading. A set of experiments was carried out to determine the saw depth of the first and second pass. Chipping and cracks were characterized using measuring scope and observed with scanning electron microscopy (SEM). Results have shown that the method is more effective and able to reduce almost 80% of the chip/lateral crack as compared to single pass process.