• DocumentCode
    170713
  • Title

    A study of the maximum theoretical power dissipation of tablets under natural convection conditions

  • Author

    Wagner, Guy R.

  • Author_Institution
    Electron. Cooling Solutions, Santa Clara, CA, USA
  • fYear
    2014
  • fDate
    24-26 Sept. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This study determines the limits of natural convection cooling for ideal handheld devices of various sizes based on simulations. Four popular tables were tested to determine the surface temperature rise under heavy computational and graphics loads. The thermal performance of each tablet based on hot spot temperature is measured against the performance of an ideal tablet of the same size and a figure of merit for the efficiency of heat dissipation is calculated to see how well they perform against the ideal tablet. The factors affecting the maximum possible power dissipation are the available surface area and surface finishes, selection of the outer shell materials, thermal interface materials, heat spreaders and air gaps. In most cases, the limiting factor in the thermal design of these devices is not the temperatures of the internal components but the temperature of the external surfaces since these are in direct contact with the skin of the user. This study presents a method for analyzing the efficiency of the thermal design of these devices.
  • Keywords
    convection; cooling; notebook computers; thermal management (packaging); air gaps; handheld device; heat dissipation; heat spreader; hot spot temperature; maximum theoretical power dissipation; natural convection cooling; outer shell material; surface temperature; tablets; thermal design; thermal interface material; thermal performance; Conductivity; Conferences; Heating; Isothermal processes; Power dissipation; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2014.6972479
  • Filename
    6972479