• DocumentCode
    1707878
  • Title

    An 82.4% efficiency package-bondwire-based four-phase fully integrated buck converter with flying capacitor for area reduction

  • Author

    Cheng Huang ; Mok, Philip K. T.

  • Author_Institution
    HKUST, Hong Kong, China
  • fYear
    2013
  • Firstpage
    362
  • Lastpage
    363
  • Abstract
    Multi-phase converters have become a topic of great interest due to the high output power capacity and output ripple cancellation effect. They are even more beneficial to nowadays high-frequency fully integrated converters with output capacitor integrated on-chip. As one of the dominant chip area consumers, reducing the size of the on-chip decoupling capacitors directly leads to cost down. It is reported that a 5× capacitor area reduction can be achieved with a four-phase converter compared to a single-phase one [1]. However, the penalty is obvious. Every extra phase comes with an inductor, which is also counted as cost and becomes more dominant with increase in the number of phases.
  • Keywords
    capacitors; inductors; integrated circuit bonding; integrated circuit packaging; power convertors; wires (electric); efficiency 82.4 percent; four-phase converter; high output power capacity; high-frequency fully integrated converter; inductor; multiphase converter; on-chip decoupling flying capacitor area reduction; output capacitor integrated on-chip; output ripple cancellation effect; package-bondwire-based four-phase fully integrated buck converter; single-phase converter; Calibration; Capacitors; Inductance; Inductors; Pulse width modulation; Switches; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487770
  • Filename
    6487770