DocumentCode :
170834
Title :
Extracting model parameters from thermal transient measurements for thermal stress simulation
Author :
Sarkany, Zoltan ; Rencz, Marta
Author_Institution :
Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2014
fDate :
24-26 Sept. 2014
Firstpage :
1
Lastpage :
5
Abstract :
In this article it is presented how structural information and temperature distribution can be calculated from thermal transient measurement results. We show how the temperature distribution can be approximated from a time domain temperature transient using simple calculations and that not only the temperatures but the geometry of a three dimensional model can also be calculated from the thermal RC network. The identification method is demonstrated using the measurement results of a simple package structure and the source and magnitude of uncertainties are also investigated.
Keywords :
RC circuits; electronics packaging; network analysis; temperature distribution; thermal stresses; package structure; structural information; temperature distribution; thermal RC network; thermal stress simulation; thermal transient measurements; three dimensional model; time domain temperature transient; Materials; Mathematical model; Semiconductor device measurement; Temperature distribution; Temperature measurement; Thermal resistance; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
Conference_Location :
London
Type :
conf
DOI :
10.1109/THERMINIC.2014.6972539
Filename :
6972539
Link To Document :
بازگشت