Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials

This paper proposes a guideline for the mechanical acceleration of end-of-lifetime prognostics of metal based die attach materials. As a such, we used first an advanced nano-effect sintered silver layer as interface between die and substrate which has very god electrical and thermal conductivities. Two pairs of experiment/simulation are scheduled. An isothermal mechanical 3-pt bending experiment to induce fatigue the specimens rapidly as well as a thermal induced strain fatigue by thermal chamber for validation. The manufactured specimens are designed to be used for both. With a FEM of this subsystem to simulate the failure parameter which is the accumulated von Mises strain, lifetime modelling is possible.