DocumentCode
1708562
Title
Miniaturized thin-film magnetic field probe with high spatial resolution for LSI chip measurement
Author
Ando, Noriaki ; Masuda, Norio ; Tarnaki, N. ; Kuriyama, Toshihide ; Saito, Shinsah ; Kato, Kunio ; Ohashi, Keishi ; Saito, Mikiko ; Yarnaguchi, M.
Author_Institution
Jisso & Production Technol. Res. Labs., NEC Corp., Sagamihara, Japan
Volume
2
fYear
2004
Firstpage
357
Abstract
It is important to obtain the absolute value of current flowing through each power line on a large-scale integrated (LSI) circuit by measurement because this current on an LSI chip is regarded as conductive noise. We have developed a thin-film magnetic field probe that has spatial resolution high enough to obtain the absolute value of high-frequency power current on an LSI chip. Spatial resolution was enhanced by miniaturizing the shielded loop coil, the detection part of the probe. The outer size of the new coil is 50×22 μm. In taking measurements with the new probe over a 60 μm wide microstrip line used as a device under test (DUT), we obtained a 6 dB decrease point of 40 μm, which indicates the spatial resolution of the probe. This value is comparable to the typical width of power lines on an LSI chip, around 50 μm and is less than half that of our conventional probes, around 90 μm. In measurements with the new probe over an LSI chip, we obtained such a fine magnetic near-field distribution that the magnetic fields generated from the lines on the chip were separated. On-chip decoupling was also confirmed by using the new probe. The new probe enables direct verification of a circuit design for suppressing electromagnetic interference (EMI), while conventional coarse mapping of the magnetic near-field cannot be used to evaluate such conductive noise.
Keywords
electric current measurement; electromagnetic interference; integrated circuit design; interference suppression; large scale integration; magnetic field measurement; probes; thin film devices; 22 micron; 40 micron; 50 micron; 60 micron; EMI suppression; LSI chip measurement; conductive noise; decoupling; electromagnetic interference suppression; large-scale integrated circuits; microstrip line; miniaturized magnetic field probe; power line current; shielded loop coil; spatial resolution; thin-film magnetic field probe; Conductive films; Electromagnetic interference; Integrated circuit measurements; Large scale integration; Magnetic field measurement; Magnetic films; Probes; Semiconductor device measurement; Spatial resolution; Thin film circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN
0-7803-8443-1
Type
conf
DOI
10.1109/ISEMC.2004.1349815
Filename
1349815
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