Title :
Modeling and simulation of signaling channel loss on printed circuit board
Author :
Foor, Jacob ; Wu, Daniel ; Chen, Ji
Author_Institution :
Hewlett Packard, Houston, TX, USA
Abstract :
The paper explores the effects from individual channel components on signal loss and investigates ways to reduce loss. Channel components include transmission lines, vias, connectors, connector thruholes, and package-mounts. An efficient interconnects extraction algorithm was first developed for frequency dependent transmission line parameter extraction. Once transmission line parameters are extracted, they can be used together with other component models in SPICE simulations. Through simulations, this study quantifies the contributions to signal loss from different components. The effects of altering these components and the benefits of following channel construction guidelines are explored.
Keywords :
SPICE; circuit simulation; frequency-domain analysis; printed circuit layout; printed circuits; transmission line theory; PCB layout; SPICE simulations; connector thruholes; finite-difference frequency-domain method; frequency dependent transmission line parameter extraction; interconnects extraction algorithm; package-mounts; printed circuit board; signal loss; signaling channel loss; transmission lines; vias; Circuit simulation; Connectors; Distributed parameter circuits; Frequency dependence; Guidelines; Integrated circuit interconnections; Packaging; Parameter extraction; Printed circuits; SPICE;
Conference_Titel :
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN :
0-7803-8443-1
DOI :
10.1109/ISEMC.2004.1349826