Title :
Development of fine pitch ball grid array
Author :
Shibata, Jun ; Horita, Manabu ; Izumi, Naoki ; Shikano, Taketoshi ; Okada, Makio ; Noguchi, Yoshie ; Imamura, Kenji ; Fukunaga, Hideki ; Yasunaga, Masatoshi ; Hirai, Tatsuya ; Hashimoto, Tomoaki ; Takemoto, Yoshitaka
Author_Institution :
Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
A fine pitch ball grid array (FBGA) has been developed which is suitable mainly for logic devices such as micro control units (MCU) and application specific integrated circuits (ASIC) for consumer portable electronic instruments. The FBGA has a construction in which a die is attached to a glass-epoxy interposer with a single layer conductor. Wire bonding and transfer molding are applied in the same manner as lead frame type packages. The FBGA has a smaller body and higher performance than conventional packages. The package structure, assembly process, performance and reliability test results are introduced
Keywords :
application specific integrated circuits; ball grid arrays; composite materials; consumer electronics; fine-pitch technology; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated logic circuits; lead bonding; microcontrollers; moulding; ASIC; FBGA; FBGA body size; FBGA performance; MCU; application specific integrated circuits; assembly process; consumer portable electronic instruments; die attach; fine pitch ball grid array; glass-epoxy interposer; lead frame type packages; logic devices; micro control units; package structure; reliability test; single layer conductor; transfer molding; wire bonding; Application specific integrated circuits; Assembly; Bonding; Conductors; Electronics packaging; Instruments; Integrated circuit packaging; Logic devices; Transfer molding; Wire;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704514
