An integrated electromagnetic/lumped modeling approach for the simulation of large multi-layer MCM designs

Author

Hammadi, S. ; Huang, C.-W.P. ; Al-Kuran, S.

Author_Institution

Anadigics Inc., Warren, NJ, USA

Volume

2

fYear

2001

Firstpage

786

Abstract

A technique for global simulation of large microwave circuits is presented. Full-wave models of multi-layer PCBs are generated then combined with passive and active element models to generate hybrid electromagnetic/lumped models for MCMs. Measurement and simulation results for a power amplifier (PA) matching circuit are provided to illustrate and validate the method.

Keywords

circuit simulation; lumped parameter networks; microwave integrated circuits; microwave power amplifiers; multichip modules; printed circuit design; PA matching circuit; active element models; dual band power amplifier; full-wave models; global simulation; hybrid electromagnetic/lumped models; integrated electromagnetic/lumped modeling; large microwave circuits; microwave integrated circuits; multi-layer MCM designs; multi-layer PCB; passive element models; Character generation; Circuit simulation; Computational modeling; Electromagnetic coupling; Electromagnetic modeling; Frequency; Hybrid power systems; Integrated circuit technology; Microwave theory and techniques; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2001. IEEE

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7070-8

Type

conf

DOI

10.1109/APS.2001.959841

Filename

959841