DocumentCode :
1710006
Title :
Improvement of dielectric strength as microstructural enhancement of XLPE insulation
Author :
Shim, Sung-Ik ; Cho, Dae-Hee ; Youn, Bok-Hee ; Takahashi, Toshihiro ; Okamoto, Tatsuki
Author_Institution :
EHV Tech. Solution Team, Yokosuka, South Korea
Volume :
1
fYear :
2005
Firstpage :
155
Abstract :
With the aim of developing XLPE insulation for extra high voltage cable, we investigated the morphology of cross-linked polyethylene. We used a kind of base materials and additives, and controlled curing condition and amount of additives. The effect of addition of additives on morphology of XLPE such as lamellar density, orientation and additive layer were analyzed using TEM analysis and X-ray diffraction test. For evaluation of breakdown strength of XLPE insulation with additives and base materials, the mold-type XLPE specimens were made and evaluated with Weibull plot parameters, and compared with morphological characteristics. We applied this result to model cable and this model cable was found to have superior dielectric strength and morphological characteristics compared with non additive added model cable.
Keywords :
X-ray diffraction; XLPE insulation; electric strength; power cable insulation; transmission electron microscopy; TEM analysis; Weibull plot parameters; X-ray diffraction; XLPE insulation; cross-linked polyethylene; dielectric strength; extra high voltage cable; lamellar density; microstructural enhancement; Additives; Cable insulation; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Morphology; Polyethylene; Voltage; X-ray diffraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location :
Kitakyushu
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193360
Filename :
1496082
Link To Document :
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