Title :
Epoxy adhesive sheet with copper foil for multiple IVH build-up technology
Author :
Kobayashi, Kazuhito ; Kumashiro, Yasushi ; Takahashi, Atushi ; Morita, Koji ; Tanabe, Takahiro
Author_Institution :
Hitachi Chem. Co. Ltd., Ibaraki, Japan
Abstract :
The interstitial via hole (IVH) structure, in which the interconnections of signal layers are designed with nonthrough holes, is strongly focused to meet the need for small and high-performance electronic equipment with thinner and high wiring density multilayer boards (MLBs). A new epoxy adhesive sheet with copper foil was developed for multiple IVH build-up technology. Since no glass cloth is used for reinforcement, the adhesive sheet allows IVH structure fabrication by CO 2 laser ablation. It has superior resin flow properties for filling both inner-pattern and inner-layer IVH structures. The surface flatness of the build-up layer with this new sheet allows very fine wiring patterns on to be fabricated. This sheet, which does not concave during the wire-bonding process since its surface is hard at high temperature, is suitable for MLBs with semiconductor chips. This material is effective for manufacture of thin MLBs with IVH structure and high wiring densities
Keywords :
adhesives; copper; foils; laminates; laser ablation; lead bonding; polymer films; printed circuit design; printed circuit manufacture; CO2; CO2 laser ablation; Cu; IVH structure; IVH structure fabrication; MLBs; build-up layer; copper foil; electronic equipment; epoxy adhesive sheet; fine wiring pattern fabrication; high wiring density multilayer boards; inner-layer IVH structure filling; inner-pattern IVH structure filling; interstitial via hole structure; multiple IVH build-up technology; nonthrough hole interconnection; resin flow properties; semiconductor chips; signal layer interconnections; surface flatness; surface hardness; thin MLBs; wire-bonding process; wiring density; Copper; Electronic equipment; Filling; Glass; Laser ablation; Nonhomogeneous media; Optical device fabrication; Resins; Signal design; Wiring;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704520
