DocumentCode
1710581
Title
Evidence for the role of the interface in polyolefin nanocomposites
Author
Roy, M. ; Reed, C.W. ; MacCrone, R.K. ; Schadler, L.S. ; Nelson, J.K. ; Keefe, R. ; Zenger, W.
Author_Institution
Rensselaer Polytech. Inst., Troy, NY, USA
Volume
1
fYear
2005
Firstpage
223
Abstract
The burgeoning area of nanodielectrics has been fueled by the demonstration of enhanced electrical and mechanical properties observed in nanoparticle filled polymers. The high surface energy and vastly augmented surface area (in comparison to conventional composites) is thought to be the underlying reason for such benefits. This paper explores the electrical properties of silicon dioxide nanoparticle/low-density cross-linked polyethylene matrix composites and the effect of the large interface on breakdown strength with both polar and non-polar surface treatments. To that end, the interface was characterized to examine the species and bonding present, and dielectric spectroscopy used to highlight the interfacial polarization. Significantly enhanced dielectric breakdown strength was observed relative to conventional microcomposites, and some speculation about the mechanism responsible is offered.
Keywords
bonds (chemical); composite material interfaces; dielectric materials; dielectric polarisation; electric breakdown; electric strength; filled polymers; nanocomposites; nanoparticles; silicon compounds; surface energy; surface treatment; SiO2; bonding; dielectric breakdown strength; dielectric spectroscopy; enhanced electrical properties; enhanced mechanical properties; interfacial polarization; microcomposites; nanodielectrics; nanoparticle filled polymers; nonpolar surface treatment; polar surface treatment; polyolefin nanocomposites; silicon dioxide nanoparticle/low-density cross-linked polyethylene matrix composites; surface area; surface energy; Bonding; Dielectrics; Electric breakdown; Electrochemical impedance spectroscopy; Mechanical factors; Nanocomposites; Polyethylene; Polymers; Silicon compounds; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Conference_Location
Kitakyushu
Print_ISBN
4-88686-063-X
Type
conf
DOI
10.1109/ISEIM.2005.193383
Filename
1496105
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