A systematic approach and comparison of different 3-D chip structures for electromagnetic compatibility

A systematic approach to estimate electromagnetic compatibility (EMC) issues in 3D package stacking is introduced. Five different structures are described and compared using a systematic method for electromagnetic compatibility investigation. The method consists of dividing different mechanical structures into smaller segments, which can be studied individually and in such a way that the EMC study is made simpler and can focus on one detail at a time. Estimations of importance of each segments is performed in reference to existing knowledge/data base. Simulations are generated to estimate the coupling effects in selected critical areas. This study highlights the strong points and weak points of the stacking methods investigated. Also the studied cases are arranged in the order of preference, namely, from EMC friendly to EMC disaster.