Title :
An advanced packaging solution for OC-768, 40Gb/s utilizing ibm standard alumina MLC technology
Author :
Dyckman, W.D. ; Pillai, Edward R.
Author_Institution :
IBM Microclectronics Division
Keywords :
Conducting materials; Coplanar waveguides; Costs; Data communication; Environmentally friendly manufacturing techniques; Microelectronics; Optical waveguides; Packaging; Radio frequency; Robustness;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216248
