DocumentCode
1711067
Title
Microwave bonding of silicon dies with thin metal films for MEMS applications
Author
Clendenin, J. ; Tung, Steve ; Budraa, N. ; Mai, John
Author_Institution
University of Arkansas
fYear
2003
Firstpage
18
Lastpage
23
Keywords
Electromagnetic heating; Gold; Infrared heating; Infrared imaging; Micromechanical devices; Numerical analysis; Radio frequency; Semiconductor films; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216250
Filename
1216250
Link To Document