Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applications

Author

Needes, Christopher R. ; Barker, Michael F. ; Ollivier, Patricia T. ; Hang, Kenneth W. ; Souders, Kenneth E. ; Wang, Carl B. ; Smith, Michael A.

Author_Institution

DuPont Electronics Technologies

fYear

2003

Firstpage

Lastpage

Keywords

Ceramics; Conducting materials; Firing; Gold; Integrated circuit packaging; Laminates; Lead; Programmable logic arrays; Robustness; Sheet materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216252

Filename

1216252

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