• DocumentCode
    1711283
  • Title

    Anticipating EMI and on-board interference in automotive platforms

  • Author

    Sun, Shishuang ; Liu, Geping ; Pommerenke, David J. ; Drewniak, James L. ; Kautz, Richard W. ; Chen, Chingchi

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
  • Volume
    3
  • fYear
    2004
  • Firstpage
    792
  • Abstract
    A dual-step MTL/FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules on an automotive platform is calculated using multiconductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcellular algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.
  • Keywords
    automobiles; automotive electronics; cables (electric); electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; multiconductor transmission lines; transmission line theory; 3D full-wave modeling; EMI; FDTD; MTL models; automotive EMC; automotive harness; automotive platforms; cable bundle; car body; commercial vehicles; common-mode discontinuities; current distribution; electronic modules; impressed current sources; multi-wire subcellular algorithm; multiconductor transmission-line models; on-board interference; radiation impedance; Automotive engineering; Current distribution; Electromagnetic interference; Finite difference methods; Impedance; Joining processes; Power cables; Time domain analysis; Transmission lines; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
  • Print_ISBN
    0-7803-8443-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2004.1349923
  • Filename
    1349923