Title :
Pb-free solder challenges in electronic packaging and assembly
Author_Institution :
Intel Cotporation
Keywords :
Assembly; Coatings; Electronic packaging thermal management; Electronics industry; Electronics packaging; Lead; Soldering; Surface finishing; Surface-mount technology; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216257
