DocumentCode
1711392
Title
Unique phase changes induced by electromigration (EM) in solder joints
Author
Gan, H. ; Xu, G. ; Tu, K.N.
Author_Institution
UCLA
fYear
2003
Firstpage
71
Lastpage
76
Keywords
Artificial intelligence; Current density; Electromigration; Electrons; Flip chip; Influenza; Integrated circuit interconnections; Soldering; Temperature; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216259
Filename
1216259
Link To Document