Title :
Reliability of the Pb-free solder bump on electroless ni under bump metallurgies
Author :
Kim, N.S. ; Jung, S.Y. ; Oh, S.Y.
Author_Institution :
Samsung Electronics Co. LTD.
Keywords :
Costs; Flip chip; Gold; Lead; Packaging; Pressure measurement; Printing; Temperature measurement; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216260
