DocumentCode
1711461
Title
Study of microvia failure under PCB flexing loads
Author
Seah, S.K.W. ; Lim, C.T. ; Tan, V.B.C. ; Quah, S.E.
Author_Institution
National University of Singapore
fYear
2003
Firstpage
95
Lastpage
99
Keywords
Assembly; Circuit testing; Copper; Dielectrics; Electronics packaging; Failure analysis; Finite element methods; Flexible printed circuits; Routing; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216262
Filename
1216262
Link To Document