Title :
Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads
Author_Institution :
Sony Ericsson Mobilc Communications, Inc.
Keywords :
Chip scale packaging; Connectors; Consumer electronics; Failure analysis; Finite element methods; Numerical models; Predictive models; Prototypes; Springs; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216263
