Title :
In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill
Author :
Bansal, S. ; Raj, P. Markondeya ; Shinotani, K. ; Bhattacharya, S. ; Tummala, R. ; Lance, M.J.
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Costs; Dielectric materials; Laboratories; Materials reliability; Materials testing; Packaging; Spectroscopy; Stress measurement; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216270
