In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill

Author

Bansal, S. ; Raj, P. Markondeya ; Shinotani, K. ; Bhattacharya, S. ; Tummala, R. ; Lance, M.J.

Author_Institution

Georgia Institute of Technology

fYear

2003

Firstpage

148

Lastpage

155

Keywords

Assembly; Costs; Dielectric materials; Laboratories; Materials reliability; Materials testing; Packaging; Spectroscopy; Stress measurement; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216270

Filename

1216270

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