Title :
Field-use conditions vs. thermal cycles - a physics-based mapping study
Author :
Tunga, Krishna ; Pyland, James ; Pucha, Raghuram V. ; Sitaramai, S.K.
Author_Institution :
Georgia Institute of Technology
Keywords :
Acceleration; Capacitive sensors; Chip scale packaging; Creep; Electronic packaging thermal management; Electronics packaging; Flip chip; Plastics; Qualifications; Thermal degradation;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216275
