Title :
Model for BGA and CSP reliability in automotive underhood applications
Author :
Lail, P. ; Islam, Nokihul ; Suhling, Jeff ; Darveaux, Robert
Author_Institution :
Auburn University
Keywords :
Assembly; Automotive engineering; Electronic packaging thermal management; Electronics packaging; Plastics; Soldering; Temperature; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216276
