Title :
Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders
Author :
Wiese, Steffen ; Meusel, Ekkehard ; Wolter, Klaus-juergen
Author_Institution :
Dresden University of Technology
Keywords :
Capacitive sensors; Creep; Electronic equipment testing; Flip chip; Flip chip solder joints; Microstructure; Optical scattering; Packaging; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216277
