• DocumentCode
    1711857
  • Title

    Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders

  • Author

    Wiese, Steffen ; Meusel, Ekkehard ; Wolter, Klaus-juergen

  • Author_Institution
    Dresden University of Technology
  • fYear
    2003
  • Firstpage
    197
  • Lastpage
    206
  • Keywords
    Capacitive sensors; Creep; Electronic equipment testing; Flip chip; Flip chip solder joints; Microstructure; Optical scattering; Packaging; Soldering; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216277
  • Filename
    1216277
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1711857