DocumentCode :
1711915
Title :
Finite element analysis to develop a new accelerating test method for board level solder joints for high temperature electronics
Author :
Neher, Wolfgang ; Kempe, Wolfgang ; Wondrak, Wolfgang ; Sauer, Wilfried
Author_Institution :
Daimler Chrysler AG
fYear :
2003
Firstpage :
221
Lastpage :
228
Keywords :
Automotive engineering; Control systems; Electronic equipment testing; Finite element methods; Industrial electronics; Lead; Life estimation; Soldering; Stress; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216280
Filename :
1216280
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1711915
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