Title :
Acceleration models, constitutive equations, and reliability of lead-free solders and joints
Author :
Lau, John ; Danksher, W. ; Vianco, Paul
Author_Institution :
Agilent Technologies. Inc.
Keywords :
Acceleration; Creep; Environmentally friendly manufacturing techniques; Equations; Lead; Life estimation; Plastics; Shape; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216281
