• DocumentCode
    1712002
  • Title

    In-process stress characterization of flip chip assembly on warped organic substrate

  • Author

    Zhang, Jim ; Ding, Hai ; Baldwin, Daniel F. ; Ume, I. Charles

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    237
  • Lastpage
    243
  • Keywords
    Assembly systems; Flip chip; Piezoresistance; Residual stresses; Resistors; Semiconductor device measurement; Silicon; Substrates; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216282
  • Filename
    1216282
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712002