Title :
In-process stress characterization of flip chip assembly on warped organic substrate
Author :
Zhang, Jim ; Ding, Hai ; Baldwin, Daniel F. ; Ume, I. Charles
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly systems; Flip chip; Piezoresistance; Residual stresses; Resistors; Semiconductor device measurement; Silicon; Substrates; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216282
