DocumentCode
1712020
Title
Flip chip assembly on PCB substrates with coined solder bumps
Author
Nah, Jae-Woong ; Paik, Kyung W. ; Cho, Soon-Jin ; Kim, Won-Hoe
Author_Institution
Korea Advanced Institute of Science and Technology
fYear
2003
Firstpage
244
Lastpage
249
Keywords
Assembly; Electrical resistance measurement; Flip chip; Gold; Integrated circuit interconnections; Packaging; Printing; Research and development; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216283
Filename
1216283
Link To Document