Title :
Solder shear strength for process control
Author :
Nair, Krishna K. ; Perkinson, Nat ; Rhine, G.A.
Author_Institution :
Unitive, Inc.
Keywords :
Capacitive sensors; Costs; Force measurement; Grain size; Joining processes; Mechanical factors; Network address translation; Process control; Temperature dependence; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216284
