Title :
Comparison of hot cathode and inductively coupled discharges for application in plasma immersed ion implantation and deposition
Author :
Kim, G.H. ; Nikiforov, S.A. ; Kan, Y. ; Cho, C.H. ; Choi, Y.W. ; Lee, H.S. ; Lim, G.H.
Author_Institution :
Korea Electrotechnol. Res. Inst., Changwon, South Korea
Abstract :
Summary form only given. Comparative analysis of plasma parameters and performance for hot cathode DC and inductively coupled 13.56 MHz RF discharges has been carried out. Both discharges were sustained in the same 18-liter cylindrical processing chamber of the self developed 30 kV experimental PIII&D facility. High emission impregnated cathodes had been used in case of DC discharge. Inductive coupling for RF discharge had been provided using a internal two-half-turn antenna, coated with Al/sub 2/O/sub 3/. Different operating modes were tested including in situ sputter deposition with simultaneous implantation. Effects of degradation of cathode emission due to coating and contamination of deposited films with cathode impregnated materials and antenna coating have been analyzed. Results are being used in the design of a 120 kV, 1 m/sup 3/ PIII&D facility which is under development now.
Keywords :
antennas in plasma; high-frequency discharges; ion implantation; plasma materials processing; plasma properties; sputter deposition; 120 kV; 13.56 MHz; 30 kV; RF discharges; antenna coating; cathode emission; cylindrical processing chamber; high emission impregnated cathodes; hot cathode DC discharge; in situ sputter deposition; inductively coupled discharges; internal two-half-turn antenna; operating modes; plasma immersed ion deposition; plasma immersed ion implantation; plasma parameters; simultaneous implantation; Cathodes; Ion implantation; Plasma applications; Plasma density; Plasma immersion ion implantation; Plasma materials processing; Plasma measurements; Plasma properties; Plasma sheaths; Radio frequency;
Conference_Titel :
Plasma Science, 1999. ICOPS '99. IEEE Conference Record - Abstracts. 1999 IEEE International Conference on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-5224-6
DOI :
10.1109/PLASMA.1999.829498
