• DocumentCode
    1712151
  • Title

    Dielectric properties of epoxy and polyethylene nanocomposites

  • Author

    Zhang, Chao ; Mason, Ralf ; Stevens, Gary C.

  • Author_Institution
    Polymer Res. Centre, Surrey Univ., Guildford, UK
  • Volume
    2
  • fYear
    2005
  • Firstpage
    393
  • Abstract
    In recent years polymer nanocomposites have attracted wide interest with regard to enhancing polymer properties and extending their utility. It has been found that the dielectric properties have a close relationship with the interfacial behavior between the fillers and the polymer matrix in such composites. In this paper, a typical bisphenol-A epoxy with anhydride hardener system and linear low-density polyethylene were chosen as matrix polymers and a nanometric size aluminium oxide was used as filler. Both ultrasonic processing and Brabender mixing were used to obtain a fine dispersion of the fillers in polymers. The dielectric properties of the composites have been measured in the frequency domain from 10-4 Hz to 10-6 Hz. Morphological characterization was carried out by scanning electron microscopy. The difference in dielectric properties between the two polymers is discussed.
  • Keywords
    dielectric losses; epoxy insulation; filled polymers; frequency-domain analysis; nanocomposites; permittivity; polyethylene insulation; scanning electron microscopy; Brabender mixing; bisphenol-A epoxy; dielectric properties; epoxy-polyethylene nanocomposites; fillers; frequency domain; interfacial behavior; morphological characterization; polymer matrix; polymer nanocomposites; scanning electron microscopy; Aluminum oxide; Dielectrics and electrical insulation; Frequency domain analysis; Mechanical factors; Nanocomposites; Nanoparticles; Plastic insulation; Polyethylene; Polymers; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
  • Print_ISBN
    4-88686-063-X
  • Type

    conf

  • DOI
    10.1109/ISEIM.2005.193571
  • Filename
    1496171